Manufacturers of active devices used in PA design often do not state the device performance outside the fundamental frequency used, nor do they provide any information about the optimum harmonic source and load impedances. The integrated de-embedding functionality within the Mesuro software, allows the user to view and load-pull devices at the current generator plane, even for high power packaged devices. This is seen as vital for waveform engineering, and also gives visibility of how close the voltage is to process boundaries, allowing more reliable designs. Using the Mesuro system, devices can be tested to arrive at reference designs with impedance matched efficiencies improving considerably on previous levels. The ability to test on-wafer or at the package level enable the device manufacturer to efficiently characterise RF power devices offering:

• Enable first pass design success improving time to market
• A competitive edge with improved device efficiency
• Ability to validate device models, including large signal
• Understand device reliability from the fundamental physics
• Wafer selection of premium value devices
• Wafer pairing of devices for balanced circuit designs
• Accurate monitoring of manufacturing processes